MECHANICAL PROPERTIES OF MEMS MATERIALS
materials used in microelectromechanical systems. Tensile stress-strain curves were measured for polysilicon, silicon nitride, silicon carbide, and electroplated nickel. For example, polysilicon has a Young’s modulus of 160 GPa and a Poisson’s ratio of 0.22. It is a linear brittle material with fracture strength as high as 3 GPa.